Black Box Model of Integrated Circuits for ESD Behavioral Simulation and Industrial Application Case

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F. Lafon A. Ramanujan P. Fernandez-Lopez

Abstract

In order to design electronic products for Electro Static Discharges constraints, the use of simulation is fundamental. This is the only solution to justify the design and to manage properly the margin during the development. In order to do so, models are required and especially for the integrated circuits (IC). A Pspice model had been developed and validated for ESD performance prediction of IC implemented inside an electronic product. Nevertheless, the practical implementation of these modeling techniques for IC induced some issues, especially under Pspice, being the targeted tool for our simulation. Divergences issues during time domain simulation were frequently observed and sometimes irresolvable with model previously proposed. We propose in this article new implementation techniques in Pspice. A practical example is used to demonstrate the capability of our model.

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How to Cite
Lafon, F., Ramanujan, A., & Fernandez-Lopez, P. (2015, November 2). Black Box Model of Integrated Circuits for ESD Behavioral Simulation and Industrial Application Case. Advanced Electromagnetics, 4(2), 26-37. https://doi.org/https://doi.org/10.7716/aem.v4i2.279
References

  1. S. Rigour, F. Lafon, and F. de Daran, Mixed electrical and thermal model for integrated circuits pulse behavior prediction, in 7th International workshop on Electromagnetic compatibility of Integrated circuits - EMC COMPO 09 - Toulouse, 2009.

  2. ISO 10605 : 2008 - Road vehicles - Test methods for electrical disturbances from electrostatic discharge.

  3. P. Besse, F. Lafon, N. Monnereau, F. Caignet, J.P. Laine, A.Salles, S. Rigour, M. Bafleur, N. Nolhier, D. Trémouilles – ESD system level characterization and modeling methods applied to a LIN transceiver Electrical Overstress - 33rd Electrostatic Discharge Symposium (EOS/ESD), 2011.

  4. Arndt, B.; zur Nieden, F.; Mueller, F.; Edenhofer, J.; Frei, S., Virtual ESD testing of automotive electronic systems, Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on , vol., no., pp.683,686, 12-16 April 2010.
    View Article

  5. F. Lafon, F. de Daran, and S. Lecointre, ESD analysis methodology, from IC behavior to PCB prediction, in 6th International workshop on Electromagnetic compatibility of Integrated circuits - EMC COMPO 07 - Torino, Italy, 2007.

  6. IEC 62014-1 ed1.0 - Electronic design automation libraries - Part 1: Input/output buffer information specifications (IBIS version 3.2) – 2001.

  7. Kai Wang; Pommerenke, D.; Chundru, R.; Van Doren, T.; Centola, F.P.; Jiu Sheng Huang, Characterization of human metal ESD reference discharge event and correlation of generator parameters to failure levelspart II: correlation of generator parameters to failure levels, Electromagnetic Compatibility, IEEE Transactions on , vol.46, no.4, pp.505,511, Nov. 2004.
    View Article

  8. Boselli, Gianluca, PhD thesis, On High Injection Mechanisms in Semiconductor Devices under ESD Conditions, 2001.

  9. Kai Wang; Pommerenke, D.; Chundru, R.; Van Doren, T.; Drewniak, J.L.; Shashindranath, A., Numerical modeling of electrostatic discharge generators, Electromagnetic Compatibility, IEEE Transactions on , vol.45, no.2, pp.258,271, May 2003.
    View Article

  10. Wunsch, D.C.; Bell, R.R., Determination of Threshold Failure Levels of Semiconductor Diodes and Transistors Due to Pulse Voltages, Nuclear Science, IEEE Transactions on , vol.15, no.6, pp.244,259, Dec. 1968.
    View Article

  11. IEC 62433-2: EMC IC modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE) - 2008.

  12. IEC 62433-4 standard proposal in UTE47A committee: EMC IC modelling Part 4: Models of Integrated Circuits for EMI behavioural simulation, Conducted Immunity modelling (ICIM-CI).

  13. F. Lafon, Techniques and methodologies development to take into account EMC constraints in automotive equipment design. Immunity analysis from component until the equipment, Doctoral Thesis, INSA de Rennes (France), January 2011.

  14. Chu-Sun Yen; Fazarinc, Z.; Wheeler, R.L., Timedomain skin-effect model for transient analysis of lossy transmission lines, Proceedings of the IEEE , vol.70, no.7, pp.750,757, July 1982.
    View Article

  15. T. Maloney, & N. Khurana, - Transmission line pulsing techniques for circuit modeling of ESD phenomena, 7th EOS/ESD Symposium, 1985.